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Volume: 32 | Article ID: art00009_1
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Newly Developed Patterning Technologies for Three-Dimensional (3D) Printed Electronics
Shizuo Tokito
Yasunori Yoshida
Konami Izumi
  DOI :  10.2352/ISSN.2169-4451.2017.32.18  Published Online :  September 2016
Abstract

We report on two newly developed patterning methods for three-dimensional (3D) printed electronics applications, which are known as soft blanket gravure (SBG) and omnidirectional inkjet (OIJ) printing technologies. These technologies make it possible to print various inks directly onto non-flat or 3D object surfaces, and have a capability that could enable new electronic applications and markets.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society for Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane Springfield, VA 22151 USA
Subject Areas :
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 DOI 10.2352/ISSN.2169-4451.2017.32.18
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  Cite this article 

Shizuo Tokito, Yasunori Yoshida, Konami Izumi, "Newly Developed Patterning Technologies for Three-Dimensional (3D) Printed Electronics"  in Proc. IS&T Printing for Fabrication: Int'l Conf. on Digital Printing Technologies (NIP32),  2016,  https://doi.org/10.2352/ISSN.2169-4451.2017.32.18

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Copyright © Society for Imaging Science and Technology 2016
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society for Imaging Science and Technology
7003 Kilworth Lane Springfield, VA 22151 USA
2169-4451(20160912)2016:1L.18;1-
dfc_21694451_v2016n1_input/s10.xml
/ist/nipdf/2016/00002016/00000001/art00009
Articles
Newly Developed Patterning Technologies for Three-Dimensional (3D) Printed Electronics
TokitoShizuo
YoshidaYasunori
IzumiKonami
12092016
2016
1
18
20
2016
We report on two newly developed patterning methods for three-dimensional (3D) printed electronics applications, which are known as soft blanket gravure (SBG) and omnidirectional inkjet (OIJ) printing technologies. These technologies make it possible to print various inks directly onto non-flat or 3D object surfaces, and have a capability that could enable new electronic applications and markets.