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Volume: 30 | Article ID: art00108_1
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Additive Manufacturing utilizing Aerosol Jet® Printing Technology for LED wire bond replacement
  DOI :  10.2352/ISSN.2169-4451.2014.30.1.art00108_1  Published OnlineJanuary 2014
Abstract

During the last years additive manufacturing has gained a lot of attention due to material cost saving- and rapid prototyping capabilities. In this paper additive manufacturing was successfully demonstrated using Aerosol Jet® Printing Technology for LED wire bond replacement in order to improve the mechanical stability of state of the art LED modules. LED working samples were fabricated by using polyimide as dielectric and silver as conductive interconnect material.Shape and thickness of the printed lines were characterized by profilometry. The conductivity of the printed silver connectors as well as the threshold voltage were measured and compared to the commercially used gold wire bonds. Results show a comparable behavior regarding electrical and optical properties.

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Andreas Rudorfer, Heinz Pichler, Christian Palfinger, Frank Reil, Franz-Peter Wenzl, Paul Hartmann, "Additive Manufacturing utilizing Aerosol Jet® Printing Technology for LED wire bond replacementin Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP30),  2014,  pp 451 - 454,  https://doi.org/10.2352/ISSN.2169-4451.2014.30.1.art00108_1

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