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Volume: 30 | Article ID: art00047_1
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Ink-Jet Printed Copper Complex MOD Ink for Plastic Electronics
  DOI :  10.2352/ISSN.2169-4451.2014.30.1.art00047_1  Published OnlineJanuary 2014
Abstract

The development of highly conductive copper patterns on low-cost flexible substrates (PET, PEN, etc.) by inkjet printing is reported. Copper films were obtained from a metallo-organic decomposition (MOD) ink composed of a copper complex and suitable low-viscosity solvents. Upon heating the ink decomposed and was converted into metallic copper under nitrogen as inert atmosphere.Additionally samples were prepared using inkjet technology on various substrates. The required layer thickness for current conduction was assessed by printing on PET and sintering at 150 °C in a vacuum oven.

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Yousef Farraj, Michael Grouchko, Shlomo Magdassi, Fritz Koch, Mirko Wittkötter, Maik Müller, Ingo Reinhold, Werner Zapka, "Ink-Jet Printed Copper Complex MOD Ink for Plastic Electronicsin Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP30),  2014,  pp 191 - 193,  https://doi.org/10.2352/ISSN.2169-4451.2014.30.1.art00047_1

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