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<!DOCTYPE article PUBLIC "-//NLM//DTD Journal Publishing DTD v2.1 20050630//EN" "http://uploads.ingentaconnect.com/docs/dtd/ingenta-journalpublishing.dtd">
<article article-type="research-article">
  <front>
    <journal-meta>
      <journal-id journal-id-type="aggregator">72010410</journal-id>
      <journal-title>NIP &amp; Digital Fabrication Conference</journal-title>
      <abbrev-journal-title>nip digi fabric conf</abbrev-journal-title>
      <issn pub-type="ppub">2169-4451</issn><issn pub-type="epub"/>
      <publisher>
        <publisher-name>Society for Imaging Science and Technology</publisher-name>
        <publisher-loc>7003 Kilworth Lane, Springfield, VA 22151, USA</publisher-loc>
      </publisher>
    </journal-meta>
    <article-meta><article-id pub-id-type="doi">10.2352/ISSN.2169-4451.2014.30.1.art00047_1</article-id>
      <article-id pub-id-type="sici">2169-4451(20140101)2014:1L.191;1-</article-id>
      <article-id pub-id-type="publisher-id">nip_v2014n1/splitsection47.xml</article-id>
      <article-id pub-id-type="other">/ist/nipdf/2014/00002014/00000001/art00047</article-id>
      <article-categories>
        <subj-group>
          <subject>Articles</subject>
        </subj-group>
      </article-categories>
      <title-group>
        <article-title>Ink-Jet Printed Copper Complex MOD Ink for Plastic Electronics</article-title>
      </title-group>
      <contrib-group>
        <contrib>
          <name>
            <surname>Farraj</surname>
            <given-names>Yousef</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Grouchko</surname>
            <given-names>Michael</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Magdassi</surname>
            <given-names>Shlomo</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Koch</surname>
            <given-names>Fritz</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Wittk&#xF6;tter</surname>
            <given-names>Mirko</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>M&#xFC;ller</surname>
            <given-names>Maik</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Reinhold</surname>
            <given-names>Ingo</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Zapka</surname>
            <given-names>Werner</given-names>
          </name>
        </contrib>
      </contrib-group>
      <pub-date>
        <day>01</day>
        <month>01</month>
        <year>2014</year>
      </pub-date>
      <volume>2014</volume>
      <issue>1</issue>
      <fpage>191</fpage>
      <lpage>193</lpage>
      <permissions>
        <copyright-year>2014</copyright-year>
      </permissions>
      <abstract>
        <p>The development of highly conductive copper patterns on low-cost flexible substrates (PET, PEN, etc.) by inkjet printing is reported. Copper films were obtained from a metallo-organic decomposition (MOD) ink composed of a copper complex and suitable low-viscosity solvents. Upon heating
 the ink decomposed and was converted into metallic copper under nitrogen as inert atmosphere.Additionally samples were prepared using inkjet technology on various substrates. The required layer thickness for current conduction was assessed by printing on PET and sintering at 150 &#xB0;C
 in a vacuum oven.</p>
      </abstract>
    </article-meta>
  </front>
</article>
