Three-dimensional stacking and integration (incl. Through Silicon Vias - TSV) of microelectronic devices are modern techniques with great potential in industrial application, but face severe cost-disadvantages. In this paper, a new filling technique for TSV based on inkjet printing with a high cost-saving potential is proposed. We give a brief explanation of this new technique and present first results of processed samples.Our TSV processing technique can be summarized in three major steps. In step one, multiple structures are pre-etched in standard silicon wafers. These structures require an electrical isolation from the surrounding substrate. In step two, a standard piezoelectric inkjet nozzle is used to print our self-developed silver ink into these structures, forming the vias. After the ink is dried, in the third and final step, the samples are sintered. Finally the TSV samples are analyzed by cross sectional polishing and a scanning electron microscope.This paper proves the feasibility of inkjet printing of TSVs by homogeneous covering of via side walls with silver particles.