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Volume: 27 | Article ID: art00014_2
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Novel Low Temperature Copper Inkjet Inks are a Low Cost Alternative to Silver for Printed Electronics
Michael J. Carmody
Jonathan Tunbridge
Tung Kong
  DOI :  10.2352/ISSN.2169-4451.2011.27.1.art00014_2  Published Online :  January 2011
Abstract

Demand for the use of metal-based inkjet inks for printed electronic applications is well known. Gold and silver based inks have been produced, but cost and performance limitations are likely to remain major obstacles to widespread adoption. Copper, which is potentially a low cost alternative, readily oxidizes, particularly in highly reactive nanoparticle form, making it unsuitable for ink formulation.However, using a combination of highly specified copper nanoparticles and a proprietary coating and functionalization process, it has been possible to protect the copper from oxidation and produce a stable copper inkjet ink.The ink enables the direct printing of copper circuits via established commercial inkjet technology. After printing, an oxide free conductive copper track is produced via rapid thermal annealing of the deposited ink. The ink has been specifically designed for photonic curing in air via high intensity light sources ie. lasers or broad band flash lamps. This low temperature curing allows the use of low cost, low temperature, flexible, and other, substrates including paper, PET, polyimide, polyester, FR4, and glass. Conductivities are comparable to commercial silver inks with significantly higher metal loadings.Information around applications and performance is presented along with plans to extend the technology to other metals and applications.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2011.27.1.art00014_2
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Michael J. Carmody, Jonathan Tunbridge, Tung Kong, "Novel Low Temperature Copper Inkjet Inks are a Low Cost Alternative to Silver for Printed Electronics"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP27),  2011,  pp 470 - 472,  https://doi.org/10.2352/ISSN.2169-4451.2011.27.1.art00014_2

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Copyright © Society for Imaging Science and Technology 2011
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20110101)2011:2L.470;1-
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Articles
Novel Low Temperature Copper Inkjet Inks are a Low Cost Alternative to Silver for Printed Electronics
CarmodyMichael J.
TunbridgeJonathan
KongTung
01012011
2011
2
470
472
2011
Demand for the use of metal-based inkjet inks for printed electronic applications is well known. Gold and silver based inks have been produced, but cost and performance limitations are likely to remain major obstacles to widespread adoption. Copper, which is potentially a low cost alternative, readily oxidizes, particularly in highly reactive nanoparticle form, making it unsuitable for ink formulation.However, using a combination of highly specified copper nanoparticles and a proprietary coating and functionalization process, it has been possible to protect the copper from oxidation and produce a stable copper inkjet ink.The ink enables the direct printing of copper circuits via established commercial inkjet technology. After printing, an oxide free conductive copper track is produced via rapid thermal annealing of the deposited ink. The ink has been specifically designed for photonic curing in air via high intensity light sources ie. lasers or broad band flash lamps. This low temperature curing allows the use of low cost, low temperature, flexible, and other, substrates including paper, PET, polyimide, polyester, FR4, and glass. Conductivities are comparable to commercial silver inks with significantly higher metal loadings.Information around applications and performance is presented along with plans to extend the technology to other metals and applications.