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Volume: 25 | Article ID: art00087_1
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Advances in Dryfilm Photoresist for Microfluidic Device Applications
Sean T. Weaver
Melanie Mathis
Eric Hall
Paul Dryer
  DOI :  10.2352/ISSN.2169-4451.2009.25.1.art00087_1  Published Online :  January 2009
Abstract

A novel approach to form a 3 dimensional microfluidic device is demonstrated by the use of a customized negative dryfilm photoresist. The formation of the microfluidic chambers utilizes a lamination process, which enables the tenting of a negative photoresist onto the thickfilm barrier layer. Specifically in this paper, we will discuss the influences of the dryfilm photoresist components and how they relate to thermo-mechanical and adhesive properties required to form a microfluidic chamber.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2009.25.1.art00087_1
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Sean T. Weaver, Melanie Mathis, Eric Hall, Paul Dryer, "Advances in Dryfilm Photoresist for Microfluidic Device Applications"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP25),  2009,  pp 312 - 315,  https://doi.org/10.2352/ISSN.2169-4451.2009.25.1.art00087_1

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Copyright © Society for Imaging Science and Technology 2009
72010410
NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20090101)2009:1L.312;1-
nip_v2009n1/splitsection87.xml
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Articles
Advances in Dryfilm Photoresist for Microfluidic Device Applications
WeaverSean T.
MathisMelanie
HallEric
DryerPaul
01012009
2009
1
312
315
2009
A novel approach to form a 3 dimensional microfluidic device is demonstrated by the use of a customized negative dryfilm photoresist. The formation of the microfluidic chambers utilizes a lamination process, which enables the tenting of a negative photoresist onto the thickfilm barrier layer. Specifically in this paper, we will discuss the influences of the dryfilm photoresist components and how they relate to thermo-mechanical and adhesive properties required to form a microfluidic chamber.