This paper studies the problem of automatically aligning the interconnections of integrated components in printed electronics modules. During the process, molding material is deformed and the components get displaced. Unless this is compensated on a per-module basis, the ink jetted connectors do not reach their targets. In this paper we propose a new connection redrawing method that applies a smooth displacement function to each pixel of the bitmap. Experiments show that using the new method, deformations are smoother, and the original shapes and intended electrical behavior are better preserved.