Inkjet technology has shortened the processing time for current electronic components and minimizes material waste during their manufacture. Inkjet-printed nano silver ink IC interconnections are presented, but their reliability at varying temperatures as well as the evaluation of their reliability after humidity tests is not exhaustively explored. In this paper, we investigated the reliability of inkjet-printed interconnections from a variable environmental point of view. We tested nano silver inkjet-printed interconnections at 85°C in 85% RH for 1,000 hours for humidity evaluation and for 1,000 cycles from −40°C to 125°C to investigate temperature-cycling-based failures in combination with JEDEC Test Standards. Greek cross-structure, which is commonly used in the semiconductor industry, was used to evaluate fluctuation of the conductivity value after variable environment conditions. On the basis of the measurements obtained, we related electrical values before and after the tests using the Greek cross-structure. Also, the printing resolution of the inkjet-printed structures and the effect of these structures on the environmental reliability in the mentioned test runs were evaluated. The results of the temperature cycling test and of the humidity test show that the inkjet-printed silver structures have a good degree of reliability.