We have studied a new digital fabrication technology using highresolution liquid toner electrophotography, which consists of fine liquid toner, high-resolution exposure unit and non-electrical transfer. Fine pitch multi-line patterns of Cu wiring can be obtained by printing fine lines with seed toners, and by electroless plating deposited on lines. Seed toners are submicrons in diameter with superfine conductive particles on the surface. The multi-line patterns of 1 pixel line-width (21.6 micrometers) with the volume resistivity of 2.1 × 10−6 Ω·cm were realized by using a liquid toner developing process with a 1200 dpi resolution LED.Furthermore, the capability of high-resolution multi-line pattern formation has been investigated by theoretical analysis. Liquid toner developing process with a 2540 dpi resolution LSU was examined by numerical simulations, taking account of the potential distributions of multi-line patterns. The capability of multi-line pattern formation of Line and Space (L/S) = 10/10 micrometers was indicated and the experimental result confirmed it.
Atsuko Iida, Koichi Ishii, Yasushi Shinjo, Hitoshi Yagi, Mitsunaga Saito, Hideki Nukada, Masaki Takahashi, Masahiro Hosoya, Naoko Yamaguchi, "A Study of Digital Fabrication using High-resolution Liquid Toner Electrophotography" in Proc. IS&T Digital Fabrication Conf., 2005, pp 26 - 29, https://doi.org/10.2352/ISSN.2169-4451.2005.21.2.art00011_3