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Volume: 21 | Article ID: art00009_3
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Novel Concepts in Direct Writing of Electronics and Sensors
Sanjay Sampath
  DOI :  10.2352/ISSN.2169-4451.2005.21.2.art00009_3  Published Online :  January 2005
Abstract

This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
Subject Areas :
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 DOI 10.2352/ISSN.2169-4451.2005.21.2.art00009_3
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  Cite this article 

Sanjay Sampath, "Novel Concepts in Direct Writing of Electronics and Sensors"  in Proc. IS&T Digital Fabrication Conf.,  2005,  pp 21 - 24,  https://doi.org/10.2352/ISSN.2169-4451.2005.21.2.art00009_3

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Copyright © Society for Imaging Science and Technology 2005
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20050101)2005:3L.21;1-
nip_v2005n3/splitsection9.xml
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Articles
Novel Concepts in Direct Writing of Electronics and Sensors
SampathSanjay
01012005
2005
3
21
24
2005
This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.