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Volume: 34 | Article ID: art00032_1
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Increased Ink Space with Existing Thermal Inkjet Silicon and Printhead Modules using Micro Pumping
Jim Przybyla
Alex Govyadinov
  DOI :  10.2352/ISSN.2169-4451.2018.34.131  Published Online :  September 2018
Abstract

High solids aqueous ink chemistries are desirable to provide high optical density and durability after application to the media but these inks can have tradeoffs in jettability due to Pigment/Vehicle separation (PiVS) and increased solvent evaporation in idle nozzles and fluidic chambers (decap) which can reduce both jettability and observed image quality (IQ). Low volatility co-solvents are commonly used to reduce decap by slowing the rate of evaporation through uncapped nozzles but these solvents have tradeoffs at the system level because final removal of these agents after deposition on media by drying can be challenging. The increased density (2400 nozzles per inch per color) of the HDNA thermal inkjet (TIJ) silicon die has been used on recently introduced HP industrial packaging printing and signage presses in a 1200 nozzle per inch configuration to enable high solids, high volatility ink chemistries with existing printhead silicon circuit designs and printhead modules by utilizing the unused nozzle positions as in-situ ink pumps to mix and flush stagnant ink from ink chambers. This configuration enables good jettability and IQ with high solids ink chemistries without requiring external ink recirculation systems.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society for Imaging Science and Technology
Subject Areas :
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 DOI 10.2352/ISSN.2169-4451.2018.34.131
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  Cite this article 

Jim Przybyla, Alex Govyadinov, "Increased Ink Space with Existing Thermal Inkjet Silicon and Printhead Modules using Micro Pumping"  in Proc. IS&T Printing for Fabrication: Int'l Conf. on Digital Printing Technologies (NIP34),  2018,  pp 131 - 134,  https://doi.org/10.2352/ISSN.2169-4451.2018.34.131

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Copyright © Society for Imaging Science and Technology 2018
72010410
NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society for Imaging Science and Technology
10.2352/ISSN.2169-4451.2018.34.131
2169-4451(20180923)2018:1L.131;1-
s32.phd
/ist/nipdf/2018/00002018/00000001/art00032
Research Articles
Increased Ink Space with Existing Thermal Inkjet Silicon and Printhead Modules using Micro Pumping
PrzybylaJim
GovyadinovAlex
23092018
2018
1
131
134
2018
High solids aqueous ink chemistries are desirable to provide high optical density and durability after application to the media but these inks can have tradeoffs in jettability due to Pigment/Vehicle separation (PiVS) and increased solvent evaporation in idle nozzles and fluidic chambers (decap) which can reduce both jettability and observed image quality (IQ). Low volatility co-solvents are commonly used to reduce decap by slowing the rate of evaporation through uncapped nozzles but these solvents have tradeoffs at the system level because final removal of these agents after deposition on media by drying can be challenging. The increased density (2400 nozzles per inch per color) of the HDNA thermal inkjet (TIJ) silicon die has been used on recently introduced HP industrial packaging printing and signage presses in a 1200 nozzle per inch configuration to enable high solids, high volatility ink chemistries with existing printhead silicon circuit designs and printhead modules by utilizing the unused nozzle positions as in-situ ink pumps to mix and flush stagnant ink from ink chambers. This configuration enables good jettability and IQ with high solids ink chemistries without requiring external ink recirculation systems.