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Volume: 29 | Article ID: art00028_2
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IEC TC119 – International Standards for Printed Electronics
Alan Hodgson
  DOI :  10.2352/ISSN.2169-4451.2013.29.1.art00028_2  Published Online :  January 2013
Abstract

IEC TC119 (Printed Electronics) represents a significant opportunity for our community. International Standards are an enabling activity to bring a technology to industrialisation and will thus aim to address the “Lab to Fab” bottleneck.The activities of IEC TC119 are now reaching a critical point. It is important that it has engagement with and contributions from the community represented at this conference.This paper gives a brief overview of the International Standards process and the organisation of IEC TC119. It looks at the proposed structure for the standardisation of Printed Electronics and surveys the areas currently being worked on.A key theme through this work is how this community can contribute to these important standards and how individuals and companies can benefit from participation.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2013.29.1.art00028_2
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  Cite this article 

Alan Hodgson, "IEC TC119 – International Standards for Printed Electronics"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP29),  2013,  pp 369 - 371,  https://doi.org/10.2352/ISSN.2169-4451.2013.29.1.art00028_2

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Copyright © Society for Imaging Science and Technology 2013
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20130101)2013:2L.369;1-
nip_v2013n2/splitsection28.xml
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Articles
IEC TC119 – International Standards for Printed Electronics
HodgsonAlan
01012013
2013
2
369
371
2013
IEC TC119 (Printed Electronics) represents a significant opportunity for our community. International Standards are an enabling activity to bring a technology to industrialisation and will thus aim to address the “Lab to Fab” bottleneck.The activities of IEC TC119 are now reaching a critical point. It is important that it has engagement with and contributions from the community represented at this conference.This paper gives a brief overview of the International Standards process and the organisation of IEC TC119. It looks at the proposed structure for the standardisation of Printed Electronics and surveys the areas currently being worked on.A key theme through this work is how this community can contribute to these important standards and how individuals and companies can benefit from participation.