Back to articles
Articles
Volume: 24 | Article ID: art00090_1
Image
Evaluation of Inkjet Printhead Materials Using EIS
  DOI :  10.2352/ISSN.2169-4451.2008.24.1.art00090_1  Published OnlineJanuary 2008
Abstract

Electrochemical Impedance Spectroscopy (EIS) was used to assess the ability of two different epoxy die attach adhesives to prevent corrosion of copper. Incorporating corrosion inhibitors in the adhesives was shown to reduce but not eliminate corrosion. EIS revealed that high water absorption in adhesives with low crosslink density significantly increased corrosion. Chloride impurities in the adhesives also increased corrosion. The diffusion coefficient of chloride in the epoxy was found to be 5 to 6 orders of magnitude lower than water. The presence of two time constants in the EIS scans correlated well with more corrosion.

Subject Areas :
Views 12
Downloads 0
 articleview.views 12
 articleview.downloads 0
  Cite this article 

James M. Mrvos, "Evaluation of Inkjet Printhead Materials Using EISin Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP24),  2008,  pp 346 - 349,  https://doi.org/10.2352/ISSN.2169-4451.2008.24.1.art00090_1

 Copy citation
  Copyright statement 
Copyright © Society for Imaging Science and Technology 2008
72010410
NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA