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Volume: 24 | Article ID: art00089_1
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Second Transfer Process Simulation II
Toyoshige Sasaki
Kousuke Yamamoto
Takuma Onishi
Asako Sugiyama
Takeshi Tomizawa
Yasuo Yoda
  DOI :  10.2352/ISSN.2169-4451.2008.24.1.art00089_1  Published Online :  January 2008
Abstract

In the second transfer process, electrostatic forces, caused by the transfer electric field, act on a sheet in the nipped region. As a result, the sheet sticks to the roller, and sheet transportation fails. We have developed a numerical simulation method of sheet transportation in the second transfer process. The method calculates sheet transportation by means of weak-coupling between electric field analysis and structural analysis, and which considers electrostatic forces acting on the sheet and displacement of components relative to each other. We used the method to calculate sheet transportation in a system that consists of two rollers and the sheet between them. In this system, the sheet passes between two rollers which contact each other and to which a voltage is applied. The calculated charge density and sheet displacement showed good agreement with experiments. Another analysis clarified the relationship between electric discharges in the nipped region and sheet sticking to the roller.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2008.24.1.art00089_1
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  Cite this article 

Toyoshige Sasaki, Kousuke Yamamoto, Takuma Onishi, Asako Sugiyama, Takeshi Tomizawa, Yasuo Yoda, "Second Transfer Process Simulation II"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP24),  2008,  pp 342 - 345,  https://doi.org/10.2352/ISSN.2169-4451.2008.24.1.art00089_1

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Copyright © Society for Imaging Science and Technology 2008
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20080101)2008:1L.342;1-
nip_v2008n1/splitsection89.xml
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Articles
Second Transfer Process Simulation II
SasakiToyoshige
YamamotoKousuke
OnishiTakuma
SugiyamaAsako
TomizawaTakeshi
YodaYasuo
01012008
2008
1
342
345
2008
In the second transfer process, electrostatic forces, caused by the transfer electric field, act on a sheet in the nipped region. As a result, the sheet sticks to the roller, and sheet transportation fails. We have developed a numerical simulation method of sheet transportation in the second transfer process. The method calculates sheet transportation by means of weak-coupling between electric field analysis and structural analysis, and which considers electrostatic forces acting on the sheet and displacement of components relative to each other. We used the method to calculate sheet transportation in a system that consists of two rollers and the sheet between them. In this system, the sheet passes between two rollers which contact each other and to which a voltage is applied. The calculated charge density and sheet displacement showed good agreement with experiments. Another analysis clarified the relationship between electric discharges in the nipped region and sheet sticking to the roller.