Droplet deposition phenomena have been studied over a wide range of timescales under conditions relevant to direct printing of etch resist patterns on printed circuit boards. UV-curing and phase-change inks were jetted from commercial drop-on-demand print heads on to copper-clad boards. Early-stage impact-driven spreading of 80 pl ink drops was imaged by 20 ns flash-based photography, while a 27,000 fps high-speed camera was used to study the later stages of spreading up to 130 ms post-impact. The initial stage was generally free from excessive drop oscillation or splashing. The effects of liquid-surface wetting and substrate temperatures were investigated. Quantitative image analysis was used to study the transition from impact-driven to capillary spreading and to derive the power law exponents for capillary spreading, which can be used to predict printed track widths.