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Volume: 23 | Article ID: art00098_2
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Epitaxial film bonding technology for integrating dissimilar device materials
Tomoki Igari
Hiroyuki Fujiwara
Takahito Suzuki
Tomohiko Sagimori
Hironori Furuta
Yusuke Nakai
Mitsuhiko Ogihara
  DOI :  10.2352/ISSN.2169-4451.2007.23.1.art00098_2  Published Online :  January 2007
Abstract

We have developed “epitaxial-film-bonding (EFB)” technology for integrating light emitting diodes (LEDs) and integrated circuit (IC) drivers. This study is focused on testing the EFB technology to fabricate two-dimensional thin film LED arrays on substrates of various materials. Transferring the thin film LED device structure that were formed on the GaAs substrates to the other substrates was tested. All the thin film LED arrays tested in this study show good performance. The EFB technology will provide new “Digital Fabrication” process for integrating dissimilar materials.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2007.23.1.art00098_2
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Tomoki Igari, Hiroyuki Fujiwara, Takahito Suzuki, Tomohiko Sagimori, Hironori Furuta, Yusuke Nakai, Mitsuhiko Ogihara, "Epitaxial film bonding technology for integrating dissimilar device materials"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP23),  2007,  pp 912 - 916,  https://doi.org/10.2352/ISSN.2169-4451.2007.23.1.art00098_2

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Copyright © Society for Imaging Science and Technology 2007
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20070101)2007:2L.912;1-
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Articles
Epitaxial film bonding technology for integrating dissimilar device materials
IgariTomoki
FujiwaraHiroyuki
SuzukiTakahito
SagimoriTomohiko
FurutaHironori
NakaiYusuke
OgiharaMitsuhiko
01012007
2007
2
912
916
2007
We have developed “epitaxial-film-bonding (EFB)” technology for integrating light emitting diodes (LEDs) and integrated circuit (IC) drivers. This study is focused on testing the EFB technology to fabricate two-dimensional thin film LED arrays on substrates of various materials. Transferring the thin film LED device structure that were formed on the GaAs substrates to the other substrates was tested. All the thin film LED arrays tested in this study show good performance. The EFB technology will provide new “Digital Fabrication” process for integrating dissimilar materials.