In recent years, there has been significant interest in the inkjet printing of electronics circuits and devices. The inkjet deposition of a single functional material on a substrate is well developed, however little attention has been paid to the sequential printing of different functional elements to generate 3D structures such as crossovers and interconnections, the passive elements in electronics. Here we discuss the issues to be addressed in the optimization process in all inkjet printing of metal/dielectric/metal interconnects and crossovers. We describe the inkjet printing of a commercial silver nanoparticle conductor on glass and onto dielectric films of various thicknesses, and discuss issues to be considered when printing multilayer interconnects and crossovers with especially emphasis on printing across interfaces and onto surfaces of different composition.