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Volume: 23 | Article ID: art00035_1
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Thermal analysis technology of full color thermal printing
  DOI :  10.2352/ISSN.2169-4451.2007.23.1.art00035_1  Published OnlineJanuary 2007
Abstract

We examined simulation of full color thermal printing.In NIP22, we reported thermal head design by automatic iterative calculation of two-dimensional heat conduction analysis. We developed the thermal head with small variation and low power consumptions by applying Taguchi Method to the parameter optimization.This time, by enhancing an analytical model to three dimensions, we became possible the simulation of the temperature distribution not only in direction of paper transportation and depth but also in in-plane each layer. As a result, the relation between the structure of thermal head and the internal temperature distribution of paper was clarified. We examined the thermal head structure that is appropriate for thermal print by using this analytical model.

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Hisashi Hoshino, Hirotoshi Terao, "Thermal analysis technology of full color thermal printingin Proc. IS&T Int'l Conf. on Digital Printing Technologies and Digital Fabrication (NIP23),  2007,  pp 138 - 141,  https://doi.org/10.2352/ISSN.2169-4451.2007.23.1.art00035_1

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