Jetable fluid delivery and other MEMS devices are being exposed to more extreme environments. These packages rely on polymeric materials as structural adhesives for various substrates. The materials also provide protection from mechanical shock; extreme thermal cycles, and can withstand long exposure to harsh chemical environments. This paper will discuss the advantages and limitations of thermoset polymeric solutions, their properties as well as the necessary selection criteria to maximize adhesion and environmental resistance. In addition, the choice of lab test methods and test design conditions are critical in the optimization, reliability and performance of the products used in the application.
Susan Krawiec, Chih-Min Cheng, Robert Palmer, "Polymeric Material Solutions for Jetable Fluid Delivery Assembly and Harsh Environment Protection" in Proc. IS&T Int'l Conf. on Digital Printing Technologies (NIP18), 2002, pp 766 - 769, https://doi.org/10.2352/ISSN.2169-4451.2002.18.1.art00086_2