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Volume: 17 | Article ID: art00086_1
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Measurement of Modulus Changes of a Phenolic Adhesive Using Nanoindentation for an Inkjet Printhead Nozzle Plate
James M. Mrvos
Girish S. Patil
Elizabeth C. Dickey
Christopher T. Wonderly
  DOI :  10.2352/ISSN.2169-4451.2001.17.1.art00086_1  Published Online :  January 2001
Abstract

Polyimide nozzle plates are bonded to inkjet printhead heater chips using a phenolic/polyvinylbutyral adhesive. A 25μm thick polyimide film is coated with a 12.5μm thick layer of a B-staged phenolic adhesive, which is cured after the nozzle plate is attached to the chip. B-staged phenolic materials undergo aging reactions at shipping and storage temperatures prior to being cured. This behavior makes it difficult to achieve consistent nozzle plate to chip adhesion. Understanding and quantifying the aging of the phenolic is necessary for predicting its adhesion performance before it is used in printhead production. In this study nanoindentation measurements of thermally aged phenolic adhesive samples were made in order to calculate the modulus of the material. Modulus measurements, XPS data, and nozzle plate adhesion results were then used as a basis for proposing a mechanism describing phenolic aging.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.2001.17.1.art00086_1
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James M. Mrvos, Girish S. Patil, Elizabeth C. Dickey, Christopher T. Wonderly, "Measurement of Modulus Changes of a Phenolic Adhesive Using Nanoindentation for an Inkjet Printhead Nozzle Plate"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies (NIP17),  2001,  pp 385 - 391,  https://doi.org/10.2352/ISSN.2169-4451.2001.17.1.art00086_1

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Copyright © Society for Imaging Science and Technology 2001
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NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(20010101)2001:1L.385;1-
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Articles
Measurement of Modulus Changes of a Phenolic Adhesive Using Nanoindentation for an Inkjet Printhead Nozzle Plate
MrvosJames M.
PatilGirish S.
DickeyElizabeth C.
WonderlyChristopher T.
01012001
2001
1
385
391
2001
Polyimide nozzle plates are bonded to inkjet printhead heater chips using a phenolic/polyvinylbutyral adhesive. A 25μm thick polyimide film is coated with a 12.5μm thick layer of a B-staged phenolic adhesive, which is cured after the nozzle plate is attached to the chip. B-staged phenolic materials undergo aging reactions at shipping and storage temperatures prior to being cured. This behavior makes it difficult to achieve consistent nozzle plate to chip adhesion. Understanding and quantifying the aging of the phenolic is necessary for predicting its adhesion performance before it is used in printhead production. In this study nanoindentation measurements of thermally aged phenolic adhesive samples were made in order to calculate the modulus of the material. Modulus measurements, XPS data, and nozzle plate adhesion results were then used as a basis for proposing a mechanism describing phenolic aging.