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Volume: 14 | Article ID: art00018_1
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Lexmark Inkjet Thickfilm Processes
John F. Sullivan
Gary R. Williams
  DOI :  10.2352/ISSN.2169-4451.1998.14.1.art00018_1  Published Online :  January 1998
Abstract

Thickfilm is an essential part of inkjet printheads. In the printheads used in Lexmark's 1100 series of printers, a dry film photosensitive laminate material is used to create the ink flow channels and to form an integral unit between the heater chip and the nozzle plate. In the printheads used for Lexmark's 7000 and 5700 series of printers, a liquid spin on photosensitive material is used to passivate the chip surface, planarize the chip surface, and promote adhesion between the nozzle plate and the chip. Both processes will be presented.

Journal Title : NIP & Digital Fabrication Conference
Publisher Name : Society of Imaging Science and Technology
Publisher Location : 7003 Kilworth Lane, Springfield, VA 22151, USA
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 DOI 10.2352/ISSN.2169-4451.1998.14.1.art00018_1
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  Cite this article 

John F. Sullivan, Gary R. Williams, "Lexmark Inkjet Thickfilm Processes"  in Proc. IS&T Int'l Conf. on Digital Printing Technologies (NIP14),  1998,  pp 76 - 79,  https://doi.org/10.2352/ISSN.2169-4451.1998.14.1.art00018_1

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Copyright © Society for Imaging Science and Technology 1998
72010410
NIP & Digital Fabrication Conference
nip digi fabric conf
2169-4451
Society of Imaging Science and Technology
7003 Kilworth Lane, Springfield, VA 22151, USA
2169-4451(19980101)1998:1L.76;1-
nip_v1998n1/splitsection18.xml
/ist/nipdf/1998/00001998/00000001/art00018
Articles
Lexmark Inkjet Thickfilm Processes
SullivanJohn F.
WilliamsGary R.
01011998
1998
1
76
79
1998
Thickfilm is an essential part of inkjet printheads. In the printheads used in Lexmark's 1100 series of printers, a dry film photosensitive laminate material is used to create the ink flow channels and to form an integral unit between the heater chip and the nozzle plate. In the printheads used for Lexmark's 7000 and 5700 series of printers, a liquid spin on photosensitive material is used to passivate the chip surface, planarize the chip surface, and promote adhesion between the nozzle plate and the chip. Both processes will be presented.