Printed electronics is a new technology for manufacturing electronic structures using standard printing processes. One emerging application area is in microelectronics packaging, where printing the interconnections allows manufacturing modules in miniature size. The basic principle is that the integrated circuits are molded into a background material such that the connection pads are left visible on top. After the background substrate has hardened, the wiring is printed on top of the module by using conductive ink. Typically, however, there are unidealities in the manufacturing process that result in the components and their connection pads being slightly displaced. This article describes an alignment and adaptation system that adapts the wiring bitmap to match the displaced components on a per-module basis. Moreover, the adjusted bitmaps can be combined together to enable printing of several modules at the same time.