Traditional methods for patterning conductive materials, such as screen-printing and photolithography, are complex and time-consuming. In this paper, we successfully combined three processes: Self-assembly polyelectrolyte (SAP) surface treatment, microdispensing catalyst patterning on the substrate, and electroless plating to form metal circuits. Due to the porous structure, these polyelectrolyte membranes are of great benefit to the absorption of the catalyst used for metal deposition. Hence, the processes above can form excellent metal pattern for various substrates, for example, PET, Glass, PI, FR-4, etc. The result has been verified by IPC 6013 standard for flexible substrate. This study also developed an image analysis method to validate the reliability of this ink jet printed circuit. It included the steps of threshold setting, erosion operation, template calibration, filtering, and edge-enhancement. After image analysis, the line width was of 135 μm on the average and the standard deviation was of 3.5 μm. The maximum blurring rate of the edge of the line observed is within ±%.