ei Electronic Imaging 2470-11732470-1173 Society for Imaging Science and Technology IS&T 7003 Kilworth Lane, Springfield, VA 22151 USA 10.2352/EI.2025.37.7.ISS-287 ISS-287 Proceedings Paper A Novel Multimodal 3D Depth Sensing Device Ma Jian Qualcomm Technologies, Inc., US Wang Shenge Qualcomm Technologies, Inc., US Dupre Matthieu Qualcomm Technologies, Inc., US Nousias Ioannis Qualcomm Technologies, Inc., US Goma Sergio Qualcomm Technologies, Inc., US Abstract

We introduce an innovative 3D depth sensing scheme that seamlessly integrates various depth sensing modalities and technologies into a single compact device. Our approach dynamically switches between depth sensing modes, including iTOF and structured light, enabling real-time data fusion of depth images. We successfully demonstrated iToF depth imaging without multipath interference (MPI), simultaneously achieving high image resolution (VGA) and high depth accuracy at a frame rate of 30 fps.

 2 2 2025 37 ISS Imaging Sensors and Systems 2025 7 287-1 287-5 This work is licensed under the Creative Commons Attribution 4.0 International License. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/. 2025 3D depth sensingIndirect Time of Flight (iToF)Multipath interferenceStructured lightDiffuse light iToFSpotlight iToFImage fusion