3D printed electronics (3DPE) is an enabling technology that has the potential to allow for the advanced track and traceability of every 3D or additively manufactured (AM) part; enable communication and sensing by an individual part; and remove geometrical limitations for electrically active devices which can directly take on the final product form factor. Additionally, AE solutions attempt to allow for faster prototyping for conventional circuit designs. HP's Multi Jet Fusion (MJF) technology is a powder-based 3D printing technology that enables the production of high mechanical performance polymer parts at high speeds and reduced costs. At HP Labs, the advanced capabilities of the MJF platform have been researched. We have developed a process for 3D printed electronics. This allows an ink-jettable conductive agent (CA) to be utilized with the MJF process to build conductive traces, vias, and contacts anywhere within or on a printed part during the 3D printing process.