Non-contact printing of conductive traces for electronic device fabrication is attractive due to its low cost, high resolution and high throughput characteristics. Inkjet printing of Ag nanoparticle inks followed by thermal or photonic sintering has the greatest potential for commercialization. In this process, the chemical and physical properties of the ink formulation and post print processing have significant impacts on the performance of the printed traces. In this paper, the effects of sintering methods and process conditions on the surface morphology and conductivity of the fabricated Ag traces are discussed.