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<article article-type="research-article">
  <front>
    <journal-meta>
      <journal-id journal-id-type="aggregator">72010410</journal-id>
      <journal-title>NIP &amp; Digital Fabrication Conference</journal-title>
      <abbrev-journal-title>nip digi fabric conf</abbrev-journal-title>
      <issn pub-type="ppub">2169-4451</issn><issn pub-type="epub"/>
      <publisher>
        <publisher-name>Society of Imaging Science and Technology</publisher-name>
        <publisher-loc>7003 Kilworth Lane, Springfield, VA 22151, USA</publisher-loc>
      </publisher>
    </journal-meta>
    <article-meta><article-id pub-id-type="doi">10.2352/ISSN.2169-4451.2006.22.2.art00006_3</article-id>
      <article-id pub-id-type="sici">2169-4451(20060101)2006:3L.12;1-</article-id>
      <article-id pub-id-type="publisher-id">nip_v2006n3/splitsection6.xml</article-id>
      <article-id pub-id-type="other">/ist/nipdf/2006/00002006/00000003/art00006</article-id>
      <article-categories>
        <subj-group>
          <subject>Articles</subject>
        </subj-group>
      </article-categories>
      <title-group>
        <article-title>Large Area Printing of Organic Electronics</article-title>
      </title-group>
      <contrib-group>
        <contrib>
          <name>
            <surname>Blanchet</surname>
            <given-names>G.</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Nuckolls</surname>
            <given-names>C.</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Lee</surname>
            <given-names>H.H</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Strano</surname>
            <given-names>M.</given-names>
          </name>
        </contrib>
        <contrib>
          <name>
            <surname>Rogers</surname>
            <given-names>J.</given-names>
          </name>
        </contrib>
      </contrib-group>
      <pub-date>
        <day>01</day>
        <month>01</month>
        <year>2006</year>
      </pub-date>
      <volume>2006</volume>
      <issue>3</issue>
      <fpage>12</fpage>
      <lpage>12</lpage>
      <permissions>
        <copyright-year>2006</copyright-year>
      </permissions>
      <abstract>
        <p>Organic electronic systems offer the possibility of lightweight, flexibility and large area coverage, properties not easily achievable with standard silicon technology, and at potentially lower manufacturing costs. DuPont has focused on the development of conducting and semiconducting
 organic materials that allow for the printing of active and passive electronic devices. A number of groups have focus in improving device performance by designing organic semiconducting materials of higher mobility. We demonstrate an alternative path for achieving high transconductance organic
 transistors in spite of relatively large source to drain distances. The method, based on creating subpercolating conducting networks, would enable the printing of submicron features with conventional commercial engines. The improvement of the electronic characteristic of such a scheme is equivalent
 to a 60-fold increase in effective mobility without reduction of the on/off ratio.These conducting and semiconducting composites are compatible with various large area printing processes such as thermal and ink jet. However, the manufacturing of complex multi-layer circuits over large
 areas in a reel-to-reel configuration has been one of the driving forces in the organic electronics field. We are currently evaluating the feasibility of micro-contact printing as a path to high-resolution reel-to-reel electronics. Thus extending flexography into the high-resolution arena.
 Unlike conventional lithography, micro-contact printing; not requiring sacrificial resists, developers, and etchants; maybe compatible with a wider range of materials and substrates currently utilized in plastic electronics.</p>
      </abstract>
    </article-meta>
  </front>
</article>
