The use of direct write micro-printing for opto-electronic packaging is being accepted as a key enabling technology, specifically printing microlenses for optical interconnects and solders for electrical interconnects. This paper presents these two areas where micro-printing technology benefits opto-electronic packaging. For increasing light coupling efficiency, a microlens array is actively aligned and attached to a VCSEL array and photodiode array in smart pixel technology. A microlens array is also directly integrated with a VCSEL array in a wafer level fabrication. Solder jet is used for either bumping the VCSEL die or for directly connecting the VCSEL die with circuits on a substrate. By using micro-printing, components can have less part-count and smaller package size. The labor required for conventional optical alignment can be greatly reduced. Thus this technical advancement offers also cost effectiveness in manufacturing.