Cost down of printed circuit boards (PCB) is one of critical issue for electronic components and semiconductor packages. A new wiring process using electrophotography technology is reported in this paper. The new process provides mask-less manufacturing and cost down capability for PCB. Cu wiring patterns can be formed by printing toner including metal fine particles and electroless plating in which metal particles work as catalyst. Insulating layer is also available in the same way by resin toner without metal particles. Repetition of patterning of insulating layer and wiring layer builds up multi-layer structure of PCB.The optimization of electrostatic charge of toner including metal particles and quality of electroless plating on patterned layer is needed. Therefore, relationships between charge of toner, electroless plating ability and contents of metal particles are clarified. Furthermore, forming insulating layer and multi-layer structure is investigated. Using samples made by the new technology, some basic reliability evaluations for PCB and soldering demonstrations are also carried out.Electrophotography process with electroless plating is confirmed to have a good ability for mask-less PCB manufacturing in electronic component applications.