We studied a thermal print head featured high-speed print. In the former paper, we reported renovated head design and structure of a thin layer showing low thermal diffusivity formed on a substrate with high thermal diffusivity to attain 1200dpi high definition print. And we have developed such print head consisted of single crystal silicon substrate and sputtered film. We also conducted FEM analysis to the newly developed print head to evaluate the possibility of high speed print. As a result, we came to a conclusion that 40IPS (inch per second) using 300dpi head was technically achievable and print test using 600dpi head proved reliable print quality.